Power semiconductor device

A power semiconductor device is provided with a base plate thermally connected to the power semiconductor element for heat generated from the power semiconductor element to be conducted to heat radiation fins. An electrically conductive member fixed to the base plate is electrically conducted to the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Goto Yoichi, Kitai Kiyofumi, Kimura Toru
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A power semiconductor device is provided with a base plate thermally connected to the power semiconductor element for heat generated from the power semiconductor element to be conducted to heat radiation fins. An electrically conductive member fixed to the base plate is electrically conducted to the base plate and is connected to ground, and has projections fitted into notches provided in the electrically conductive member. By deforming the projections, the electrically conductive member is fixed to the base plate and electrical conduction can be secured. With this arrangement, noise radiated from the power semiconductor element is reduced and malfunction of the power semiconductor element is suppressed.