Light emitting device package, wavelength conversion film, and manufacturing method thereof

A light emitting device package is provided. The package includes a light emitting device including a substrate, and a light emitting structure having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on the substrate; and a wavelength conversion film disposed in a path of light emitted by the light emitting device and having phosphor layers stacked on each other. A portion of the phosphor layers includes phosphor structures including a wavelength conversion material receiving light emitted from the light emitting device and converting a wavelength thereof and a binding resin binding the wavelength conversion material, and a transparent resin filling spaces between the phosphor structures.