Vacuum lamination of depth-sensing camera module PCB to stiffener using built-in vacuum channels

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for vacuum lamination of a depth-sensing camera module PCB to a stiffener using built-in vacuum channels. For instance, there is disclosed in accordance with one embodiment means for assembling an electronics module, in which such means include at least affixing a plurality of top-side components to a top side of a printed circuit board; affixing a plurality of bottom-side components to the bottom side of the printed circuit board; sealing a stiffener plate to the bottom side of the printed circuit board, in which the stiffener plate includes a plurality of cavities to accommodate the plurality of bottom-side components affixed to the bottom side of the printed circuit board, and further in which the plurality of cavities are interconnected via one or more channels; applying a vacuum to the stiffener plate via a vacuum port of the stiffener plate to pull the printed circuit board onto the stiffener plate; and bonding the stiffener plate to the bottom side of the printed circuit board while the printed circuit board is held to the stiffener plate via the vacuum. Other related embodiments are disclosed.