Integrated circuit packaging system with interposer structure and method of manufacture thereof

Integrated circuit packaging system with interposer structure and method of manufacture thereof

A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.

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Bibliographische Detailangaben
Hauptverfasser: Cuong Dao Nguyen Phu, Foh Bartholomew Liao Chung, Espiritu Emmanuel, Camacho Zigmund Ramirez, Punzalan Jeffrey David
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.