Method for manufacturing a surface mount device

A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured...

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Bibliographische Detailangaben
Hauptverfasser:	Vranicar Anthony, Pineda Martin G, Bhatawadekar Kedar V, Nitzan Dov, Sepulveda Mario G, Ngo Minh V
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS
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Beschreibung
Zusammenfassung:	A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day.