Printed circuit boards and methods of manufacturing thereof

A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer, wherein the polymer includes metallic particles.

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Bibliographische Detailangaben
Hauptverfasser:	Mahler Joachim, Otremba Ralf
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer, wherein the polymer includes metallic particles.