Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

Heating within a plane of a substrate may be uniform while a thermal budget is decreased. A substrate processing apparatus includes a process chamber configured to accommodate a substrate; a substrate mounting unit installed in the process chamber and configured to have the substrate placed thereon;...

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Bibliographische Detailangaben
Hauptverfasser: Hamano Katsuyoshi, Umekawa Atsushi, Okuno Masahisa, Ishii Akinori, Joda Takuya
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Heating within a plane of a substrate may be uniform while a thermal budget is decreased. A substrate processing apparatus includes a process chamber configured to accommodate a substrate; a substrate mounting unit installed in the process chamber and configured to have the substrate placed thereon; an electromagnetic wave supply unit configured to supply an electromagnetic wave to the substrate placed on the substrate mounting unit; and a choke groove formed on a side surface of the substrate mounting unit.