Semiconductor package

A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Nakamura Takashi, Tamakawa Michiaki, Watanabe Shinji, Iwasaki Toshihiro, Nakamura Shingo, Miyakoshi Takeshi, Matsubara Hiroaki, Honda Hirokazu, Ishido Kiminori, Sakumoto Shotaro, Hosoyamada Sumikazu, Kumagaya Yoshikazu, Demachi Hiroshi, Chikai Tomoshige
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; and a heat transfer member provided on the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device.