Package structure with an elastomer with lower elastic modulus

Package structure with an elastomer with lower elastic modulus

A package structure includes a substrate, at least one electronic component, a housing and at least one strut. The at least one electronic component is disposed on a first surface of the substrate. The housing covers the first surface of the substrate. The housing has an accommodation space. The at...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Wan Zhengfen, Cheng Wei, Xu Haibin, Zhao Zhenqing, Wang Tao
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A package structure includes a substrate, at least one electronic component, a housing and at least one strut. The at least one electronic component is disposed on a first surface of the substrate. The housing covers the first surface of the substrate. The housing has an accommodation space. The at least one electronic component is accommodated within the accommodation space. The at least one strut is protruded from an inner surface of the housing and extended toward the accommodation space. The at least one elastomer is arranged between the corresponding strut and the substrate.