Heat sink structure with a vapor-permeable membrane for two-phase cooling

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carry...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ellsworth, Jr. Michael J, Iyengar Madhusudan K, David Milnes P, Chu Richard C, Campbell Levi A, Simons Robert E
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).