Automatic impedance tuning with RF dual level pulsing

Methods and systems for RF pulse reflection reduction are provided herein. In some embodiments, a method includes (a) providing a plurality of pulsed RF power waveforms from a plurality of RF generators to a process chamber during a first duty cycle, (b) measuring a first power level impedance Z1 an...

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1. Verfasser: Kawasaki Katsumasa
Format: Patent
Sprache:eng
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Zusammenfassung:Methods and systems for RF pulse reflection reduction are provided herein. In some embodiments, a method includes (a) providing a plurality of pulsed RF power waveforms from a plurality of RF generators to a process chamber during a first duty cycle, (b) measuring a first power level impedance Z1 and a different second power level impedance Z2 at different time periods during the first duty cycle, (c) adjusting the second power level impedance Z2 towards 50 ohm such that a standing wave ratio (SWR) of the second power level impedance Z2 decreases towards 50 ohm and a SWR of the first power level impedance Z1 increases from 50 ohm, and (e) repeating (d) until the SWR of the first power level impedance Z1 is substantially equal to the SWR of the second power level impedance Z2.