Semiconductor device and semiconductor module

A semiconductor device in the preferred embodiment includes: a lead frame comprising a die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface of the die pad, wherein the lead frame excluding a bottom surface thereof and the semiconductor chip are sealed by a seali...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Yoneyama Rei, Obara Taichi, Nishida Nobuya, Okabe Hiroyuki
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor device in the preferred embodiment includes: a lead frame comprising a die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface of the die pad, wherein the lead frame excluding a bottom surface thereof and the semiconductor chip are sealed by a sealing resin, and an unevenness is introduced on a bonding interface between the surface of the die pad and the semiconductor chip.