Optoelectronic module with improved optical system

The invention relates to an optoelectronic module (112), more particularly to an optoelectronic chip-on-board module (114). The optoelectronic module (112) comprises a substrate (116), wherein the substrate (116) has a planar design. Furthermore, the optoelectronic module (112) comprises a plurality...

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Bibliographische Detailangaben
Hauptverfasser:	Schadt Susanne, Maiweg Harald, Peil Michael
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The invention relates to an optoelectronic module (112), more particularly to an optoelectronic chip-on-board module (114). The optoelectronic module (112) comprises a substrate (116), wherein the substrate (116) has a planar design. Furthermore, the optoelectronic module (112) comprises a plurality of optoelectronic components (118) that are arranged on the substrate (116). The optoelectronic module (110) further comprises at least one optical system (120) applied onto the substrate (114), more particularly a microoptical system having a plurality of microoptical elements. The optical system (120) comprises at least one primary optical system (124) that is adjacent to the optoelectronic components (116) and at least one secondary optical system (138).