Sensor-based removal of a soldered device

An apparatus includes at least one grip mechanism of a rework nozzle configured to grip an electrical component that is soldered to a printed circuit board. The apparatus includes at least one spring coupled to at least one grip mechanism, where the spring is configured to move beyond a minimum thre...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Huang Michk, Davis, Jr. Willie Theodore, Kelly Matthew Stephen
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS REGULATING SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An apparatus includes at least one grip mechanism of a rework nozzle configured to grip an electrical component that is soldered to a printed circuit board. The apparatus includes at least one spring coupled to at least one grip mechanism, where the spring is configured to move beyond a minimum threshold in response to an initiation of a melt of a solder that attaches the electrical component to the printed circuit board. The apparatus includes at least one sensor coupled to at least one spring, where the sensor is configured to detect the move of at least one spring beyond the minimum threshold. At least one sensor is configured to communicate at least one activate signal in response to detection of the move of one or more springs beyond the minimum threshold.