System for the combined, probe-based mechanical and electrical testing of MEMS

A system for testing MEMS-structures includes a microforce sensor, two or more multi-axis micropositioning units, at least one electrical probe and a sample holder on which a MEMS-structure is mounted. At least one of the multi-axis micropositioning units is motorized and at least one additional mic...

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Bibliographische Detailangaben
Hauptverfasser:	Beyeler Felix, Frost Daniel, Bolliger Christoph, Beyeler David, Muntwyler Simon
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS MEASURING MEASURING ELECTRIC VARIABLES MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MEASURING MAGNETIC VARIABLES MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TARIFF METERING APPARATUS TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A system for testing MEMS-structures includes a microforce sensor, two or more multi-axis micropositioning units, at least one electrical probe and a sample holder on which a MEMS-structure is mounted. At least one of the multi-axis micropositioning units is motorized and at least one additional micropositioning unit is equipped with at least one electrical probe to apply electrical signals or to measure electrical signals at one or multiple locations on the MEMS structure. The system with the aforementioned components allows a combined electrical and probe-based mechanical testing of MEMS-structures.