Resin composition, resin film, and electronic device

A resin composition containing a binder resin (A), alkoxysilyl group-containing (meth)acrylate compound (B), tetrafunctional or higher functional (meth)acrylate compound (C), and photopolymerization initiator (D), wherein a total content of the alkoxysilyl group-containing (meth)acrylate compound (B...

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Bibliographische Detailangaben
1. Verfasser:	Shindo Hiroaki
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A resin composition containing a binder resin (A), alkoxysilyl group-containing (meth)acrylate compound (B), tetrafunctional or higher functional (meth)acrylate compound (C), and photopolymerization initiator (D), wherein a total content of the alkoxysilyl group-containing (meth)acrylate compound (B) and the tetrafunctional or higher functional (meth)acrylate compound (C) is 0.5 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.