DRAM with SDRAM interface, and hybrid flash memory module

When DRAMs that are high-speed memories and flash memories that are lower in speed but can be larger in capacity than the DRAM are to be mounted on a DIMM, what matters in maximizing CPU memory bus throughput is the arrangement of the mounted components. The present disclosure provides a memory modu...

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Hauptverfasser: Osaka Hideki, Sumikura Taishi, Shibata Masabumi, Fukumura Yuusuke, Idei Akio, Fukuda Yuichi, Muraoka Satoshi, Uematsu Yutaka, Ueno Hitoshi, Watanabe Satoru, Kakita Hiroshi, Naito Michinori, Ono Takayuki, Miyagawa Takashi
Format: Patent
Sprache:eng
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Zusammenfassung:When DRAMs that are high-speed memories and flash memories that are lower in speed but can be larger in capacity than the DRAM are to be mounted on a DIMM, what matters in maximizing CPU memory bus throughput is the arrangement of the mounted components. The present disclosure provides a memory module (DIMM) that includes memory controllers arranged on the module surface closer to a socket terminal and DRAMs serving as high-speed memories arranged on the back surface. Nonvolatile memories as large-capacity memories are arranged on the side farther from the socket terminal.