Headphone device

There is provided a headphone device including a first housing and a second housing; a headband connected to the first and second housings; a first headphone unit and a second headphone unit disposed in the first and second housings, respectively; a first microphone and a second microphone arranged...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	Oide Kenichi
Format:	Patent
Sprache:	eng
Schlagworte:	ACOUSTICS ACOUSTICS NOT OTHERWISE PROVIDED FOR DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL MUSICAL INSTRUMENTS PHYSICS PUBLIC ADDRESS SYSTEMS SOUND-PRODUCING DEVICES
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Beschreibung
Zusammenfassung:	There is provided a headphone device including a first housing and a second housing; a headband connected to the first and second housings; a first headphone unit and a second headphone unit disposed in the first and second housings, respectively; a first microphone and a second microphone arranged in the vicinity of the first and second headphone units; and a signal processing unit disposed in the first housing for processing input audio signals from the outside and microphone signals detected by the first and second microphones, and generating first and second noise-canceled audio signals to be supplied to the first and second headphone units.