Wiring substrate, semiconductor package, and method for manufacturing semiconductor package

A wiring substrate includes a block with substrates laid out in an array. The block includes corners and a plan view center. Each substrate includes a substrate body. Pads are formed on the substrate body. Each pad includes a pad surface. The pads of the substrates include first pads, which are the pads of one of the substrates located in at least one of the corners of the block. The pad surface of each of the first pads includes a first axis extending from the first pad toward the plan view center of the block. The pad surface of each of the first pads has a first length along the corresponding first axis and a second length along a second axis, which is orthogonal to the first axis. The first length is longer than the second length.