Thermosetting resin composition

(A) A thermosetting resin containing an SiH group and an alkenyl group, wherein the thermosetting resin is a reaction product between silsesquioxane having the SiH group and organopolysiloxane having two alkenyl groups; (B) a linear organopolysiloxane compound having an SiH group only at one termina...

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Bibliographische Detailangaben
Hauptverfasser:	Kawabata Kiichi, Tajima Akio, Ayama Koichi, Matsuo Takashi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	(A) A thermosetting resin containing an SiH group and an alkenyl group, wherein the thermosetting resin is a reaction product between silsesquioxane having the SiH group and organopolysiloxane having two alkenyl groups; (B) a linear organopolysiloxane compound having an SiH group only at one terminal; (C) a silane coupling agent having an epoxy group; and (D) a Pt catalyst.