Electronic package and fabrication method thereof

Electronic package and fabrication method thereof

An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and expose...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Fang Hao-Ju, Tsai Tsung-Hsien, Chiu Chih-Hsien, Chung Hsin-Lung, Chu Yude
Format: Patent
Sprache:eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.