Patterned thin foil

An adhesive may be applied to a surface of a reusable carrier. Metal foil may be attached to the adhesive to couple the metal foil to the surface of the reusable carrier. The metal foil may be patterned without damaging the reusable carrier. A semiconductor structure (e.g., a solar cell) may be atta...

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Bibliographische Detailangaben
Hauptverfasser:	Kim Taeseok, Sewell Richard, Harley Gabriel, Pass Thomas, Tu Xiuwen, Kavulak David F. J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	An adhesive may be applied to a surface of a reusable carrier. Metal foil may be attached to the adhesive to couple the metal foil to the surface of the reusable carrier. The metal foil may be patterned without damaging the reusable carrier. A semiconductor structure (e.g., a solar cell) may be attached to the patterned metal foil. The reusable carrier may then be removed. In some embodiments, the semiconductor structure may be encapsulated using an encapsulant, with the adhesive being compatible with the encapsulant.