Method of manufacturing semiconductor devices

A method of manufacturing a semiconductor device including the steps of providing a substrate having first type semiconductor regions and second type semiconductor regions, forming a conformal first epitaxy mask layer on the substrate, forming first type epitaxial layer in the substrate of the first...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hung Yu-Hsiang, Liu Chia-Jong, Chang Chung-Fu, Cheng Home-Been, Wu Yen-Liang, Chou Pei-Yu
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method of manufacturing a semiconductor device including the steps of providing a substrate having first type semiconductor regions and second type semiconductor regions, forming a conformal first epitaxy mask layer on the substrate, forming first type epitaxial layer in the substrate of the first type semiconductor regions, forming a conformal second epitaxy mask layer on the substrate, forming second type epitaxial layer in the substrate of the second type semiconductor regions, and removing the second epitaxy mask layer.