Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device

A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side....

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Bibliographische Detailangaben
Hauptverfasser:	Marzano Thomas, Woods Jason, Winn Steven W, Tang Xiaohong, Brendel Richard L, Seitz Keith W, Stevenson Robert A, Thiebolt William C, Frysz Christine A, Frustaci Dominick J
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHEMISTRY CONVERSION OR DISTRIBUTION OF ELECTRIC POWER CURRENT COLLECTORS ELECTRICITY ELECTROTHERAPY FERROUS OR NON-FERROUS ALLOYS GENERATION HUMAN NECESSITIES HYGIENE INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES LINE CONNECTORS MAGNETOTHERAPY MEDICAL OR VETERINARY SCIENCE METALLURGY RADIATION THERAPY TREATMENT OF ALLOYS OR NON-FERROUS METALS ULTRASOUND THERAPY
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Beschreibung
Zusammenfassung:	A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.