Centralized memory repair block

Embodiments provide centralized redundancy block repair for memory circuits. Certain embodiments are implemented in context of high-performance memory, such as last-level cache design, where the primary memory bank often uses high-density memory cells ("bitcells") and supports long self-bitline structures to increase compactness. In such contexts, it can be difficult to finish read operations within a single cycle, even when the entire cache is divided into small bank pieces. Bank-interleaved structure in clusters can be implemented to allow access to different memory banks in consecutive cycles, thereby achieving overall single circle throughput (i.e., the latency can be masked by the interleaving). Accordingly, some embodiments of the centralized block repair can support bank interleaved access, for example, with a strict single-cycle throughput. Some embodiments can also support other features, such as row repair and/or column repair.