Non-covalently crosslinkable materials for photolithography processes

This invention describes compositions and methods of using non-covalently crosslinked resin coatings for lithographic applications. These materials are designed to undergo, after coating, a change that provides solvent resistance and, with some materials, simultaneous aqueous-base solubility. Non-co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Swope Michael B, Sullivan Daniel M, Huang Runhui, Neef Charles J, Dai Jinhua
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:This invention describes compositions and methods of using non-covalently crosslinked resin coatings for lithographic applications. These materials are designed to undergo, after coating, a change that provides solvent resistance and, with some materials, simultaneous aqueous-base solubility. Non-covalent interactions allow for easier removal of these coatings than of covalently crosslinked materials. These types of materials are well-suited for trench and gap fill applications, as well as for anti-reflective coatings, spin-on carbon layers, and etch masks.