Substrate processing and alignment

A substrate can efficiently be manufactured by separating the alignment and the actual processing when an alignment mark is provided, which is fixed with respect to the substrate and when position information on a position of a process area on the substrate is retrieved with respect to the alignment...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	Thallner Erich
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS THEREFOR MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES NANOTECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate can efficiently be manufactured by separating the alignment and the actual processing when an alignment mark is provided, which is fixed with respect to the substrate and when position information on a position of a process area on the substrate is retrieved with respect to the alignment mark before the substrate is processed. During the processing alignment can then be performed by redetermining the position of the alignment mark only once and by using the stored position information on the position of the process area.