Image sensor unit, image reading apparatus, and paper sheet distinguishing apparatus

An image sensor unit includes: a plurality of light sources each including an LED chip; a plurality of light guides that are arranged in parallel to face incident surfaces on one side in a longitudinal direction for each of the plurality of light sources and that guide light from the plurality of li...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Matsui Ryoki, Kinoshita Junya, Tsumekawa Yoshihiko, Chiba Takashi, Kureishi Yoshio, Takahashi Hidehisa, Tashiro Suguru, Shimoda Shuuichi, Fujiwara Akifumi, Yoshida Hidemasa
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CHECKING-DEVICES COLORIMETRY COMPUTING COUNTING HANDLING OF COINS OR OF PAPER CURRENCY OR SIMILAR VALUABLEPAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING,DISPENSING, CHANGING OR DEPOSITING HANDLING RECORD CARRIERS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING PHYSICS PRESENTATION OF DATA RADIATION PYROMETRY RECOGNITION OF DATA RECORD CARRIERS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An image sensor unit includes: a plurality of light sources each including an LED chip; a plurality of light guides that are arranged in parallel to face incident surfaces on one side in a longitudinal direction for each of the plurality of light sources and that guide light from the plurality of light sources to a bill; an image sensor that converts light from the bill to an electric signal; a sensor substrate for mounting the image sensor; and a circuit board that is provided with the plurality of light sources on a same mounting surface and that is arranged on the sensor substrate on one side in the longitudinal direction of the plurality of light guides, wherein the sensor substrate includes a connection hole on one side in the longitudinal direction of the sensor substrate, and the circuit board is connected to the sensor substrate by connecting a connecting portion including a plurality of external connection pads to the connection hole.