Molding material and liquid ejection flow path member using the same

The invention provides a molding material including a liquid epoxy resin composition containing an epoxy resin, a curing agent or a curing catalyst, a filler, a thixotropy-imparting agent, and a wetting dispersant.

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Bibliographische Detailangaben
Hauptverfasser:	Kawamura Shogo, Imamura Isao, Shino Yoshiyuki
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING TYPEWRITERS USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention provides a molding material including a liquid epoxy resin composition containing an epoxy resin, a curing agent or a curing catalyst, a filler, a thixotropy-imparting agent, and a wetting dispersant.