Electronic device structures joined using shrinking and expanding attachment structures

An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal dev...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Sauers Jason C, Bushnell Tyler S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING CURRENT COLLECTORS ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape due the application of chemicals or other treatments.