Photo-curable/thermally curable composition, method for manufacturing cured product thereof, cured product, and printed wiring board including the same

A photocurable and thermally curable composition having a viscosity suitable for application to an inkjet printer is prepared. By the composition, it is made possible to directly draw a pattern on a substrate for a printed wiring board. The composition is cured at a relatively low temperature, havin...

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Bibliographische Detailangaben
Hauptverfasser: Ushiki Shigeru, Shimura Masayuki, Yoda Takeshi, Choi Sungho
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A photocurable and thermally curable composition having a viscosity suitable for application to an inkjet printer is prepared. By the composition, it is made possible to directly draw a pattern on a substrate for a printed wiring board. The composition is cured at a relatively low temperature, having excellent adhesion, chemical resistance, heat resistance, and insulating properties after curing. The photocurable and thermally curable composition includes a (meth)acryloyl group-containing monomer, a block isocyanate, and a photo-polymerization initiator, wherein the composition is applicable to inkjet printing.