Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor body

Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor body

A cutout (11), which penetrates the semiconductor body, is present in the semiconductor body (1). A conductor layer (6), which is electrically conductively connected to a metal plane (3) on or over the semiconductor body, screens the semiconductor body electrically from the cutout. The conductor lay...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Minixhofer Rainer, Kraft Jochen, Teva Jordi, Stückler Ewald, Koppitsch Günther, Schrems Martin
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A cutout (11), which penetrates the semiconductor body, is present in the semiconductor body (1). A conductor layer (6), which is electrically conductively connected to a metal plane (3) on or over the semiconductor body, screens the semiconductor body electrically from the cutout. The conductor layer can be metal, optionally with a barrier layer (6a), or a doped region of the semiconductor body.