Circuit board and method for manufacturing same

A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite conne...

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Bibliographische Detailangaben
Hauptverfasser:	Onodera Minoru, Suzuki Shigeaki, Matsunaga Shuji, Sunamoto Tatsuya
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad, and the first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.