Electronic component assembly

Electronic component assembly

An electronic component assembly including a first electronic component including a plurality of first electrodes provided on a first major surface of the first electronic component; and a second electronic component including a plurality of second electrodes provided on a first major surface of the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Nakatani Seiichi, Karashima Seiji, Kitae Takashi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBINED OPERATIONS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Beschreibung
Zusammenfassung:An electronic component assembly including a first electronic component including a plurality of first electrodes provided on a first major surface of the first electronic component; and a second electronic component including a plurality of second electrodes provided on a first major surface of the second electronic component. A resin including solder powder is provided between the first electronic component and the second electronic component. Also, solder connections are provided to electrically interconnect the first and second electrodes. Elongated grooves are provided in surfaces of the electronic components. The grooves are provided for generation of bubbles during the process for producing the electronic component assembly to promote movement of the solder powder.