Package for high frequency circuits
The present invention relates to integrated circuit packaging and methods of manufacturing these. In particular, but not exclusively the present invention relates to improvements in the suppression of spurious wave modes within cavity packages in which are mounted circuits operating at high frequenc...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to integrated circuit packaging and methods of manufacturing these. In particular, but not exclusively the present invention relates to improvements in the suppression of spurious wave modes within cavity packages in which are mounted circuits operating at high frequencies, for example Monolithic Microwave Integrated Circuits (MMIC's). |
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