Semiconductor device

In order to prevent a crack from developing in an interlayer insulating film formed under a bonding pad due to impact forces, the bonding pad is formed so that small diameter metal plugs and large diameter metal plugs are arranged between a first metal film and a second metal film as an uppermost la...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Yamamoto Sukehiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!