Semiconductor device
In order to prevent a crack from developing in an interlayer insulating film formed under a bonding pad due to impact forces, the bonding pad is formed so that small diameter metal plugs and large diameter metal plugs are arranged between a first metal film and a second metal film as an uppermost la...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | In order to prevent a crack from developing in an interlayer insulating film formed under a bonding pad due to impact forces, the bonding pad is formed so that small diameter metal plugs and large diameter metal plugs are arranged between a first metal film and a second metal film as an uppermost layer. Holes are formed in the centers of the larger diameter metal plugs and recessed portions are formed in surface areas of the second metal film above the large diameter metal plugs. |
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