Fast switching IGBT with embedded emitter shorting contacts and method for making same

Integrated circuits are presented having high voltage IGBTs with integral emitter shorts and fabrication processes using wafer bonding or gown epitaxial silicon for controlled drift region thickness and fast switching speed.

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Bibliographische Detailangaben
Hauptverfasser: PENDHARKAR SAMEER, KOREC JACEK, NEILSON JOHN MANNING SAVIDGE
Format: Patent
Sprache:eng
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Zusammenfassung:Integrated circuits are presented having high voltage IGBTs with integral emitter shorts and fabrication processes using wafer bonding or gown epitaxial silicon for controlled drift region thickness and fast switching speed.