Low surface energy bonding adhesive formulation and process for the use thereof

An adhesive two-part formulation is provided that includes an amount of free-radical curable monomers, each of said monomers containing at least one acrylate moiety. Also preset in the formulation is an amount of a chlorosulfonated polymer; a Lewis acid; a polyfunctional monomer amount of dimethacry...

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Hauptverfasser: CARBUTT PETER, DOE DAN, DESHPANDE SUBODH, SHUKLA BRAJESH, KOSHTI PRASHANT
Format: Patent
Sprache:eng
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Zusammenfassung:An adhesive two-part formulation is provided that includes an amount of free-radical curable monomers, each of said monomers containing at least one acrylate moiety. Also preset in the formulation is an amount of a chlorosulfonated polymer; a Lewis acid; a polyfunctional monomer amount of dimethacrylate monomer, trimethacrylate monomer, an elastomer, a thermoplastic additive, or a combination thereof. A borane-amine complex is provided as an activator. A process of applying the formulation to a substrate includes mixing together the formulation components such that each part has a storage stability at 50° C. for 30 days where the viscosity at 30 days is within 40% of an initial viscosity. The mixture is applied to the substrate and then allowed to cure to achieve an initial strength of at least 345 kiloPascals (kPa) within 30 minutes and 40 minutes for adhesive:activator weight ratio of 1:1 and 10:1, respectively.