Thermal module accounting for increased board/die size in a portable computer

This application relates to a low profile, small footprint cooling stack that does not extend substantially beyond a footprint of an integrated circuit to which it is affixed. The cooling stack utilizes a number of beam springs that supply a seating force to the integrated circuit by way of a metal...

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Bibliographische Detailangaben
Hauptverfasser:	REID GAVIN J, DEGNER BRETT W, SMITH BRANDON S, SHAN RAYMOND S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	This application relates to a low profile, small footprint cooling stack that does not extend substantially beyond a footprint of an integrated circuit to which it is affixed. The cooling stack utilizes a number of beam springs that supply a seating force to the integrated circuit by way of a metal slug. In some embodiments, a bottom surface of the metal slug can be contoured in accordance with a top surface of the integrated circuit and/or socket. In other embodiments a gap between peripheral portion of a bottom surface of the metal slug and an associated printed circuit board can be filled by a layer of foam to reduce auditory signals generated by the integrated circuit.