Methods and devices for determining logical to physical mapping on an integrated circuit

Methods and devices for mapping logical addresses to physical locations on an integrated circuit die are disclosed herein. An embodiment of the method includes fabricating a die, where the die has a plurality of bits that are electrically accessible by way of logical addresses. A plurality of bits h...

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Bibliographische Detailangaben
Hauptverfasser: KASPER ABHA SINGH, WAITE HAROLD C, PLUMTON DONALD L, RULLAN ERIC D, ASHBURN STANTON PETREE, CORUM DANIEL L, PRINSLOW DOUGLAS A
Format: Patent
Sprache:eng
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Zusammenfassung:Methods and devices for mapping logical addresses to physical locations on an integrated circuit die are disclosed herein. An embodiment of the method includes fabricating a die, where the die has a plurality of bits that are electrically accessible by way of logical addresses. A plurality of bits have known defects that form a predetermined fault pattern at a predetermined location on the die. The bits are tested by using the logical addresses, wherein the testing yields data as to the functionality of the bits. The test results are searched for the predetermined fault pattern. The physical locations of the defective bits constituting the predetermined fault pattern are correlated with their logical addresses based on the location of the predetermined fault pattern.