Heat sink in the aperture of substrate

A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecti...

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Bibliographische Detailangaben
Hauptverfasser:	HOSOYAMADA SUMIKAZU, NAKAMURA SHINGO, NIWA KOICHIRO, WATANABE SHINJI, CHIKAI TOMOSHIGE, IWASAKI TOSHIHIRO, ISHIDO KIMINORI, HONDA HIROKAZU, MIYAKOSHI TAKESHI, MATSUBARA HIROAKI, SAKUMOTO SHOTARO, KUMAGAYA YOSHIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture.