Routing signals via hinge assemblies for mobile computing devices

Embodiments of the invention describe a hinge assembly to rotatably couple a first housing to a second housing, wherein an interconnect extends through the hinge assembly as an incorporated portion of the hinge assembly, the interconnect to communicatively couple a component located in the first hou...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PEEK GREGORY A, IDSINGA ANDY S
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Embodiments of the invention describe a hinge assembly to rotatably couple a first housing to a second housing, wherein an interconnect extends through the hinge assembly as an incorporated portion of the hinge assembly, the interconnect to communicatively couple a component located in the first housing to a component located in a second housing.