Structure and method of integrating waveguides, photodetectors and logic devices
A method for monolithically integrating semiconductor waveguides, photodetectors and logic devices, i.e., field effect transistors, on a same substrate is provided. The method includes the use of a double semiconductor-on-insulator substrate that includes from bottom to top, a handle substrate, a fi...
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| creator | REZNICEK ALEXANDER SCHAUB JEREMY D LIU FEI OUYANG CHRISTINE Q |
| description | A method for monolithically integrating semiconductor waveguides, photodetectors and logic devices, i.e., field effect transistors, on a same substrate is provided. The method includes the use of a double semiconductor-on-insulator substrate that includes from bottom to top, a handle substrate, a first insulator layer, a first semiconductor material layer, a second insulator layer, and a second semiconductor material layer. The waveguides, photodetectors and logic devices can be formed in different regions of the substrate and are present atop a first insulator layer of the double semiconductor-on-insulator substrate. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9356163B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9356163B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9356163B13</originalsourceid><addsrcrecordid>eNqNy7EKwjAURuEsDqK-w30AHUqw4GpRHIXqXELyNw3U3JDc1NcXxAdwOst31ureS65WagaZ6OgFmdgRjxSiwGcjIXp6mwW-BoeypzSxsIPACufynWb2wZLDEizKVq1GMxfsft0oul4e3e2AxANKMhYRMjz7kz62TavPjf6DfABy4jea</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Structure and method of integrating waveguides, photodetectors and logic devices</title><source>esp@cenet</source><creator>REZNICEK ALEXANDER ; SCHAUB JEREMY D ; LIU FEI ; OUYANG CHRISTINE Q</creator><creatorcontrib>REZNICEK ALEXANDER ; SCHAUB JEREMY D ; LIU FEI ; OUYANG CHRISTINE Q</creatorcontrib><description>A method for monolithically integrating semiconductor waveguides, photodetectors and logic devices, i.e., field effect transistors, on a same substrate is provided. The method includes the use of a double semiconductor-on-insulator substrate that includes from bottom to top, a handle substrate, a first insulator layer, a first semiconductor material layer, a second insulator layer, and a second semiconductor material layer. The waveguides, photodetectors and logic devices can be formed in different regions of the substrate and are present atop a first insulator layer of the double semiconductor-on-insulator substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160531&DB=EPODOC&CC=US&NR=9356163B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160531&DB=EPODOC&CC=US&NR=9356163B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>REZNICEK ALEXANDER</creatorcontrib><creatorcontrib>SCHAUB JEREMY D</creatorcontrib><creatorcontrib>LIU FEI</creatorcontrib><creatorcontrib>OUYANG CHRISTINE Q</creatorcontrib><title>Structure and method of integrating waveguides, photodetectors and logic devices</title><description>A method for monolithically integrating semiconductor waveguides, photodetectors and logic devices, i.e., field effect transistors, on a same substrate is provided. The method includes the use of a double semiconductor-on-insulator substrate that includes from bottom to top, a handle substrate, a first insulator layer, a first semiconductor material layer, a second insulator layer, and a second semiconductor material layer. The waveguides, photodetectors and logic devices can be formed in different regions of the substrate and are present atop a first insulator layer of the double semiconductor-on-insulator substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy7EKwjAURuEsDqK-w30AHUqw4GpRHIXqXELyNw3U3JDc1NcXxAdwOst31ureS65WagaZ6OgFmdgRjxSiwGcjIXp6mwW-BoeypzSxsIPACufynWb2wZLDEizKVq1GMxfsft0oul4e3e2AxANKMhYRMjz7kz62TavPjf6DfABy4jea</recordid><startdate>20160531</startdate><enddate>20160531</enddate><creator>REZNICEK ALEXANDER</creator><creator>SCHAUB JEREMY D</creator><creator>LIU FEI</creator><creator>OUYANG CHRISTINE Q</creator><scope>EVB</scope></search><sort><creationdate>20160531</creationdate><title>Structure and method of integrating waveguides, photodetectors and logic devices</title><author>REZNICEK ALEXANDER ; SCHAUB JEREMY D ; LIU FEI ; OUYANG CHRISTINE Q</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9356163B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</topic><toplevel>online_resources</toplevel><creatorcontrib>REZNICEK ALEXANDER</creatorcontrib><creatorcontrib>SCHAUB JEREMY D</creatorcontrib><creatorcontrib>LIU FEI</creatorcontrib><creatorcontrib>OUYANG CHRISTINE Q</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>REZNICEK ALEXANDER</au><au>SCHAUB JEREMY D</au><au>LIU FEI</au><au>OUYANG CHRISTINE Q</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Structure and method of integrating waveguides, photodetectors and logic devices</title><date>2016-05-31</date><risdate>2016</risdate><abstract>A method for monolithically integrating semiconductor waveguides, photodetectors and logic devices, i.e., field effect transistors, on a same substrate is provided. The method includes the use of a double semiconductor-on-insulator substrate that includes from bottom to top, a handle substrate, a first insulator layer, a first semiconductor material layer, a second insulator layer, and a second semiconductor material layer. The waveguides, photodetectors and logic devices can be formed in different regions of the substrate and are present atop a first insulator layer of the double semiconductor-on-insulator substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE |
| title | Structure and method of integrating waveguides, photodetectors and logic devices |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T23%3A25%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=REZNICEK%20ALEXANDER&rft.date=2016-05-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9356163B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |