Polyamic acid, polyimide, polyamic acid solution, and use of polyimide

The object of the present invention is to obtain the polyimide and the polyamic acid excellent in heat resistance, low thermal expansion property, and transparency and achieve low birefringence and to provide a product or a member, demanded to have high heat resistance and transparency, by using the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OZAWA SHINJI, ABO TOMOHIRO, FUJII MARI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The object of the present invention is to obtain the polyimide and the polyamic acid excellent in heat resistance, low thermal expansion property, and transparency and achieve low birefringence and to provide a product or a member, demanded to have high heat resistance and transparency, by using the polyimide or the polyamic acid. In particular, the object is to provide a product and a member in which the polyimide or the polyamic acid of the present invention is formed on a surface of an inorganic substance such as glass, metal, a metal oxide, or a single crystal silicon. The objects are attained by introducing a rigid structure and an alicyclic structure into a skeleton and using a monomer having a fluorene skeleton together.