Semiconductor package stack structure having interposer substrate

Semiconductor package stack structure having interposer substrate

Provided is a semiconductor package stack structure. The semiconductor package stack structure includes a lower semiconductor package, an interposer substrate disposed on the lower semiconductor package and having a horizontal width greater than a horizontal width of the lower semiconductor package,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM JONG-KOOK, JANG BYOUNG-WOOK
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Provided is a semiconductor package stack structure. The semiconductor package stack structure includes a lower semiconductor package, an interposer substrate disposed on the lower semiconductor package and having a horizontal width greater than a horizontal width of the lower semiconductor package, an upper semiconductor package disposed on the interposer substrate, and underfill portions filling a space between the lower semiconductor package and the interposer substrate and surround side surfaces of the lower semiconductor package.