Semiconductor device and method of fabricating the same

A semiconductor device may include a substrate having a first region and a second region on a surface thereof, and a first semiconductor fin on the first region of the substrate with the first semiconductor fin including a first trench therethrough. A first gate electrode may be provided in the firs...

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Bibliographische Detailangaben
Hauptverfasser: KIM KYUNG-EUN, LEE DONG JIN, HWANG YOOSANG, KIM KANG-UK, SON NAKJIN, KIM JIYOUNG, KIM HYOUNGSUB, HWANG JIHYE, JANG SUNGHO, KIM DAEIK
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor device may include a substrate having a first region and a second region on a surface thereof, and a first semiconductor fin on the first region of the substrate with the first semiconductor fin including a first trench therethrough. A first gate electrode may be provided in the first trench, and first and second source/drain regions may be provided in the first semiconductor fin, with the first gate electrode between the first and second source/drain regions. A second semiconductor fin may be provided on the second region of the substrate with the second semiconductor fin including a second trench therethrough, a second gate electrode may be provided in the second trench, and third and fourth source/drain regions may be provided in the second semiconductor fin with the second gate electrode being between the third and fourth source/drain regions.