Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same

Various embodiments facilitate die protection for an integrated circuit. In one embodiment, a multilayer structure is formed in multiple levels and along the edges of a die to prevent and detect damages to the die. The multilayer structure includes a support layer, a first plurality of dielectric pi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XU YIHENG, RADENS CARL, CLEVENGER LAWRENCE A, KIM BYOUNG YOUP, KLEEMEIER WALTER, ZHANG JOHN H
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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