Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same

Various embodiments facilitate die protection for an integrated circuit. In one embodiment, a multilayer structure is formed in multiple levels and along the edges of a die to prevent and detect damages to the die. The multilayer structure includes a support layer, a first plurality of dielectric pi...

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Hauptverfasser: XU YIHENG, RADENS CARL, CLEVENGER LAWRENCE A, KIM BYOUNG YOUP, KLEEMEIER WALTER, ZHANG JOHN H
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creator XU YIHENG
RADENS CARL
CLEVENGER LAWRENCE A
KIM BYOUNG YOUP
KLEEMEIER WALTER
ZHANG JOHN H
description Various embodiments facilitate die protection for an integrated circuit. In one embodiment, a multilayer structure is formed in multiple levels and along the edges of a die to prevent and detect damages to the die. The multilayer structure includes a support layer, a first plurality of dielectric pillars overlying the support layer, a metal layer that fills spaces between the first plurality of dielectric pillars, an insulation layer overlying the first plurality of dielectric pillars and the metal layer, a second plurality of dielectric pillars overlying the insulation layer, and a second metal layer that fills spaces between the second plurality of dielectric pillars.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same
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