Implementing low temperature wafer test

Implementing low temperature wafer test

A method and structure are provided for implementing low temperature wafer testing of a completed wafer. A coolant gel is applied to the completed wafer, the gel coated wafer is cooled and one or more electrical test probes are applied through the gel to electrical contacts of the cooled wafer, and...

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Hauptverfasser: KUCZYNSKI JOSEPH, NICKEL STEVEN R, HEBIG TRAVIS R
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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creator KUCZYNSKI JOSEPH
NICKEL STEVEN R
HEBIG TRAVIS R
description A method and structure are provided for implementing low temperature wafer testing of a completed wafer. A coolant gel is applied to the completed wafer, the gel coated wafer is cooled and one or more electrical test probes are applied through the gel to electrical contacts of the cooled wafer, and testing is performed.
format Patent
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subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title Implementing low temperature wafer test
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